3D integration in VLSI circuits : implementation technologies and applications /Publisher: Boca Raton, FL : CRC Press/Taylor & Francis Group,
Date: [2018] This title can be found in 1 Iowa libraries.
Through silicon vias : materials, models, design, and performance /Author: Kaushik, Brajesh Kumar,
Publisher: Boca Raton, FL : CRC Press, Taylor & Francis Group,
Date: [2017] This title can be found in 1 Iowa libraries.
Three-dimensional integrated circuit design /Author: Pavlidis, Vasilis F.,
Publisher: Cambridge, MA : Morgan Kaufmann Publishers,
Date: [2017] This title can be found in 1 Iowa libraries.
3D IC integration and packaging /Author: Lau, John H.,
Publisher: New York : McGraw-Hill Education,
Date: [2016] This title can be found in 1 Iowa libraries.
Advances in 3D integrated circuits and systems /Author: Yu, Hao
Publisher: Singapore ; World Scientific Publishing Co. Pte. Ltd.,
Date: [2016]. This title can be found in 1 Iowa libraries.
Physical design for 3D integrated circuits /Publisher: Boca Raton : CRC Press, Taylor & Francis Group, CRC Press is an imprint of the Taylor & Francis Group, an informa business,
Date: [2016] This title can be found in 1 Iowa libraries.
Vertical 3D memory technologies /Author: Prince, Betty,
Publisher: Chichester, West Sussex, United Kingdom : Wiley,
Date: 2014. This title can be found in 1 Iowa libraries.
Design and modeling for 3D ICs and interposers /Author: Swaminathan, Madhavan
Publisher: Singapore ; World Scientific
Date: c2014. This title can be found in 1 Iowa libraries.
Through-silicon Vias for 3d Integration /Author: Lau, John H.
Publisher: New York : McGraw-Hill,
Date: c2013. This title can be found in 1 Iowa libraries.
Electrical modeling and design for 3D integration : 3D integrated circuits and packaging signal integrity, power integrity, and EMC /Author: Li, Er-Ping.
Publisher: Hoboken, N.J. : Wiley-IEEE Press,
Date: c2012. This title can be found in 1 Iowa libraries.
Stress management for 3D ICs using through silicon vias : International Workshop on Stress Management for 3D ICs Using Through Silicon Vias, Albany, NY, U.S.A, March 16, 2010, San Francisco, CA, U.S.A., July 13, 2010, Dresden, Germany, October 20, 2010 /Publisher: Melville, N.Y. : American Institute of Physics,
Date: 2011. This title can be found in 1 Iowa libraries.
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