Low thermal expansion alloys and composites : proceedings of a symposium co-sponsored by the Refractory Metals Committee of the Structural Materials Division (SMD) and the Electronic Packaging and Interconnection Materials Committee of the Electronic, Magnetic, and Photonics Materials Division (EMPMD), held at the Fall Meeting of the Minerals, Metals and Materials Society in Chicago, Illinois, November 2-5, 1992 /Publisher: Warrendale, Pa. : Minerals, Metals & Materials Society,
Date: c1994. This title can be found in 1 Iowa libraries.
Materials issues for advanced electronic and opto-electronic connectors /Publisher: Warrendale, Pa. : Minerals, Metals & Materials Society,
Date: c1991. This title can be found in 1 Iowa libraries.
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