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Author:
International Workshop on Stress Management for 3D ICs Using Through Silicon Vias (2010 : Albany, N.Y.)
Title:
Stress management for 3D ICs using through silicon vias : International Workshop on Stress Management for 3D ICs Using Through Silicon Vias, Albany, NY, U.S.A, March 16, 2010, San Francisco, CA, U.S.A., July 13, 2010, Dresden, Germany, October 20, 2010 / editors, Ehrenfried Zschech ... [et al].
Publisher:
American Institute of Physics,
Copyright Date:
2011
Description:
vi, 175 p. : ill. ; 24 cm.
Subject:
Three-dimensional integrated circuits--Design and construction--Congresses.
Stress relaxation--Simulation methods--Congresses.
Strains and stresses--Simulation methods--Congresses.
Strains and stresses--Measurement--Congresses.
Other Authors:
Zschech, Ehrenfried.
International Workshop on Stress Management for 3D ICs Using Through Silicon Vias (2010 : San Francisco, Calif.)
International Workshop on Stress Management for 3D ICs Using Through Silicon Vias (2010 : Dresden, Germany)
Notes:
Includes bibliographical references and index.
Contents:
White papers -- Multi-scale modeling -- Multi-scale materials parameters -- Multi-scale stress characterization -- ISV : process characterization and failure analysis.
Series:
AIP conference proceedings, 0094-243X ; 1378
ISBN:
0735409382
9780735409385
OCLC:
(OCoLC)756595612
LCCN:
2011909347
Locations:
USUX851 -- Iowa State University - Parks Library (Ames)

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