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Author:
Interconnect Challenges for CMOS Technology - Materials, Processes and Reliability for Downscaling, Packaging and 3D Stacking (Symposium) (2012 : San Francisco, Calif.)
Title:
Interconnect challenges for CMOS technology - materials, processes and reliability for downscaling, packaging and 3D stacking : April 9-13, 2012, San Francisco, California, USA / [editors, G. Dubois, F. Iacopi, A. Sekiguchi, S. W. King, C. Dussarat].
Publisher:
Cambridge University Press,
Copyright Date:
2012
Description:
87 pages : illustrations ; 24 cm.
Subject:
Metal oxide semiconductors, Complementary--Design and construction--Congresses.
Materials--Research--Congresses.
Other Authors:
Dubois, Geraud, editor of compilation.
Iacopi, F. (Francesca), editor of compilation.
Sekiguchi, A. (Atsuko), editor of compilation.
King, S. W. (Sean W.), editor of compilation.
Dussarat, C. (Christian), editor of compilation.
Materials Research Society. Spring Meeting (2012 : San Francisco, Calif.)
Notes:
Held at the 2012 MRS Spring Meeting as Symposium C. "Printed from e-media with permission by: Curran Associates, Inc." Includes bibliographical references and index.
Series:
MRS symposium series ; volume 1428
ISBN:
1627482377 (paperback)
9781627482370 (paperback)
OCLC:
(OCoLC)850328143
Locations:
OVUX522 -- University of Iowa Libraries (Iowa City)

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